IC694MDL660 GE Fanuc PACSystems RX3i Datasheet & Technical Manual

IC694MDL660 GE Fanuc PACSystems RX3i Datasheet & Technical ManualGE Fanuc IC694MDL660 PACSystems RX3i Input Module Configured for high density physical signal acquisition in PACSystems RX3i platform architectures, the GE Fanuc IC694MDL660 (IC694MDL660 32 Point DC Input Module) provides direct physical electrical execution. This hardware component processes 32 discrete digital inputs grouped into four isolated channels of eight points each, enabling simultaneous tracking of positive or negative logic configurations.

2 kg Dimensions Standard M1 module width Operating Temp -30 to +60 deg C Power Consumption System backplane dependent Interface Channels 2 Independent CAN interfaces Supported Protocols CANopen (Master/Slave)

Number of Channels: 16 channels

CE Certified Operating Temp -30 to +65 deg C Storage Temp -40 to +85 deg C Weight 3

0m versions

enabling predictive maintenance

Yokogawa CP461-51 CENTUM VP / CS 3000 Processor

as outputs will default to the off-state (0 VDC) upon removal

enabling unified plant monitoring

and indicators

A: The control circuit requires a clean frequency input from a magnetic pickup (MPU) capable of delivering signals across a range up to 11450 Hz

The Allen-Bradley 1769-L23E-QB1B operates as an all-in-one packaged controller solution inside the high-performance CompactLogix family by Rockwell Automation

this hardware platform does not support Removal and Insertion Under Power (RIUP)